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TC55VEM316AXBN40,55 2002-07-23 1/14 tentative toshiba mos digital inte grated circuit silicon gate cmos 524,288-word by 16-bit full cmos static ram description the TC55VEM316AXBN is a 8,388,608-bit static random access memory (sram) organized as 524,288 words by 16 bits. fabricated using toshiba's cmos silicon gate process technology, this de vice operates from a single 2.3 to 3.6 v power supply. advanced circuit technology provides bo th high speed and low power at an operating current of 3 ma/mhz and a minimum cycle time of 40 ns. it is automatically placed in low-power mode at 0.7 a standby current (at v dd = 3 v, ta = 25c, typical) when chip enable ( ce1 ) is asserted high or (ce2) is asserted low. there are three control inputs. ce1 and ce2 are used to select the device and for data retention control, and output enable ( oe ) provides fast memory access. data byte control pin ( lb , ub ) provides lower and upper byte access. this device is well suited to various microprocessor syst em applications where high speed, low power and battery backup are required. and, with a guaranteed operating extreme temperature range of ? 40 to 85c, the TC55VEM316AXBN can be used in environments exhi biting extreme temperature conditions. the TC55VEM316AXBN is available in a plastic 48-ball bga. features ? low-power dissipation operating: 9 mw/mhz (typical) ? single power supply voltage of 2.3 to 3.6 v ? power down features using ce1 and ce2 ? data retention supply voltage of 1.5 to 3.6 v ? direct ttl compatibility for all inputs and outputs ? wide operating temperature range of ? 40 to 85c ? standby current (maximum): 3.6 v 10 a 3.0 v 5 a pin assignment (top view) pin names 48 pin bga a0~a18 address inputs 1 ce , ce2 chip enable r/w read/write control oe output enable lb , ub data byte control i/o1~i/o16 data inputs/outputs v dd power gnd ground nc no connection op* option * : op pin must be open or connected to gnd. ? access times: TC55VEM316AXBN 40 55 access time 40 ns 55 ns 1 ce access time 40 ns 55 ns ce2 access time 40 ns 55 ns oe access time 25 ns 30 ns ? package: p-tfbga48-0811-0.75bz (weight: g typ) a b c d e f g h 1 oe ub i/o11 i/o12 i/o13 i/o14 nc a8 a0 a3 a5 a17 op a14 a12 a9 a1 a4 a6 a7 a16 a15 a13 a10 a2 1 ce i/o2 i/o4 i/o5 i/o6 r/w a11 ce2 i/o1 i/o3 v dd v ss i/o7 i/o8 nc lb i/o9 i/o10 v ss v dd i/o15 i/o16 a18 2 3 4 5 6
TC55VEM316AXBN40,55 2002-07-23 2/14 block diagram v dd gnd i/o1 ce i/o8 r/w ce i/o9 i/o16 oe ub lb 1 ce a0 a1 a2 a3 a4 a5 a16 ce2 ce a6 a7 a8 a9 a10 a11 a12 a13 a14 a15 a17 a18 i/o2 i/o3 i/o4 i/o5 i/o6 i/o7 i/o10 i/o11 i/o12 i/o13 i/o14 i/o15 row address decoder row address buffer row address register memory cell array 4,096 128 16 (8,388,608) data input buffer data input buffer data output buffer data output buffer sense amp column address register column address decoder column address buffer clock generator
TC55VEM316AXBN40,55 2002-07-23 3/14 operating mode mode 1 ce ce2 oe r/w lb ub i/o1~i/o8 i/o9~i/o16 power l h l h l l output output i ddo l h l h h l high-z output i ddo read l h l h l h output high-z i ddo l h * l l l input input i ddo l h * l h l high-z input i ddo write l h * l l h input high-z i ddo l h h h l l high-z high-z i ddo l h h h h l high-z high-z i ddo output deselect l h h h l h high-z high-z i ddo h * * * * * high-z high-z i dds * l * * * * high-z high-z i dds standby * * * * h h high-z high-z i dds * = don't care h = logic high l = logic low maximum ratings symbol rating value unit v dd power supply voltage ? 0.3~4.2 v v in input voltage ? 0.3 * ~4.2 v v i/o input/output voltage ? 0.5~v dd + 0.5 v p d power dissipation 0.6 w t solder soldering temperature (10s) 260 c t stg storage temperature ? 55~125 c t opr operating temperature ? 40~85 c * : ? 2.0 v when measured at a pulse width of 20ns dc recommended operating conditions ( ta = ? 40 to 85c ) symbol parameter min typ max unit v dd power supply voltage 2.3 ? 3.6 v v dd = 2.3 v~2.7 v 2.0 v ih input high voltage v dd = 2.7 v~3.6 v 2.2 ? v dd + 0.3 v v il input low voltage ? 0.3 * ? v dd 0.24 v v dh data retention supply voltage 1.5 ? 3.6 v * : ? 2.0 v when measured at a pulse width of 20ns
TC55VEM316AXBN40,55 2002-07-23 4/14 dc characteristics (ta = ? 40 to 85c, v dd = 2.3 to 3.6 v) symbol parameter test condition min typ max unit i il input leakage current v in = 0 v~v dd ? ? 1.0 a i oh output high current v oh = v dd ? 0.5 v ? 0.5 ? ? ma i ol output low current v ol = 0.4 v 2.1 ? ? ma i lo output leakage current 1 ce = v ih or ce2 = v il or lb = ub = v ih or r/w = v il or oe = v ih , v out = 0 v~v dd ? ? 1.0 a min ? ? 35 i ddo1 1 ce = v il and ce2 = v ih and r/w = v ih , lb = ub = v il , i out = 0 ma other input = v ih /v il 1 s ? ? 8 ma min ? ? 30 i ddo2 operating current 1 ce = 0.2 v and ce2 = v dd ? 0.2 v and r/w = v dd ? 0.2 v, lb = ub = 0.2 v, i out = 0 ma other input = v dd ? 0.2 v/0.2 v t cycle 1 s ? ? 3 ma i dds1 1) 1 ce = v ih or ce2 = v il 2) lb = ub = v ih ? ? 1 ma v dd = 3.3v 0.3 v ta = ? 40~85c ? ? 10 ta = 25c ? 0.7 ? ta = ? 40~40c ? ? 2 i dds2 standby current 1) ce1 = v dd ? 0.2 v, ce2 = 0.2 v 2) ce2 = 0.2 v 3) lb = ub = v dd ? 0.2 v, ce1 = 0.2 v, ce2 = v dd ? 0.2 v v dd = 3.0 v ta = ? 40~85c ? ? 5 a capacitance (ta = 25c, f = 1 mhz) symbol parameter test condition max unit c in input capacitance v in = gnd 10 pf c out output capacitance v out = gnd 10 pf note: this parameter is periodically sampled and is not 100% tested.
TC55VEM316AXBN40,55 2002-07-23 5/14 ac characteristics and operating conditions (ta = ? 40 to 85c, v dd = 2.7 to 3.6 v) read cycle TC55VEM316AXBN 40 55 symbol parameter min max min max unit t rc read cycle time 40 ? 55 ? t acc address access time ? 40 ? 55 t co1 chip enable( 1 ce ) access time ? 40 ? 55 t co2 chip enable(ce2) access time ? 40 ? 55 t oe output enable access time ? 25 ? 30 t ba data byte control access time ? 40 ? 55 t coe chip enable low to output active 5 ? 5 ? t oee output enable low to output active 0 ? 0 ? t be data byte control low to output active 5 ? 5 ? t od chip enable high to output high-z ? 20 ? 25 t odo output enable high to output high-z ? 20 ? 25 t bd data byte control high to output high-z ? 20 ? 25 t oh output data hold time 10 ? 10 ? ns write cycle TC55VEM316AXBN 40 55 symbol parameter min max min max unit t wc write cycle time 40 ? 55 ? t wp write pulse width 30 ? 40 ? t cw chip enable to end of write 35 ? 45 ? t bw data byte control to end of write 35 ? 45 ? t as address setup time 0 ? 0 ? t wr write recovery time 0 ? 0 ? t odw r/w low to output high-z ? 20 ? 25 t oew r/w high to output active 0 ? 0 ? t ds data setup time 20 ? 25 ? t dh data hold time 0 ? 0 ? ns note: t od , t odo , t bd and t odw are specified in time when an output becom es high impedance, and are not judged depending on an output voltage level.
TC55VEM316AXBN40,55 2002-07-23 6/14 ac characteristics and operating conditions (ta = ? 40 to 85c, v dd = 2.3 to 3.6 v) read cycle TC55VEM316AXBN 40 55 symbol parameter min max min max unit t rc read cycle time 55 ? 70 ? t acc address access time ? 55 ? 70 t co1 chip enable( 1 ce ) access time ? 55 ? 70 t co2 chip enable(ce2) access time ? 55 ? 70 t oe output enable access time ? 30 ? 35 t ba data byte control access time ? 55 ? 70 t coe chip enable low to output active 5 ? 5 ? t oee output enable low to output active 0 ? 0 ? t be data byte control low to output active 5 ? 5 ? t od chip enable high to output high-z ? 25 ? 30 t odo output enable high to output high-z ? 25 ? 30 t bd data byte control high to output high-z ? 25 ? 30 t oh output data hold time 10 ? 10 ? ns write cycle TC55VEM316AXBN 40 55 symbol parameter min max min max unit t wc write cycle time 55 ? 70 ? t wp write pulse width 40 ? 50 ? t cw chip enable to end of write 45 ? 55 ? t bw data byte control to end of write 45 ? 55 ? t as address setup time 0 ? 0 ? t wr write recovery time 0 ? 0 ? t odw r/w low to output high-z ? 25 ? 30 t oew r/w high to output active 0 ? 0 ? t ds data setup time 25 ? 30 ? t dh data hold time 0 ? 0 ? ns note: t od , t odo , t bd and t odw are specified in time when an output becomes high impedance, and are not judged depending on an output voltage level.
TC55VEM316AXBN40,55 2002-07-23 7/14 ac test conditions parameter test condition input pulse level 0.2 v, v dd 0.7 v + 0.2 v t r , t f 1v / ns(fig.1) timing measurements v dd 0.5 reference level v dd 0.5 output load 30 pf + 1 ttl gate(fig.2) fig.1 : input rise and fall time fig.2 : output load dout 30 pf r2 v tm r1 r1 = 810 ? r2 = 1610 ? v tm = 2.3 v gnd 90% 1 v/ns t r 10% 90% 10% t f v dd typ 1 v/ns
TC55VEM316AXBN40,55 2002-07-23 8/14 timing diagrams read cycle (see note 1) write cycle 1 (r/w controlled) (see note 4) ce2 t rc t acc t od valid data out t oe t be t bd hi-z hi-z t co1 1 ce oe t ba t coe t oh t odo t oee t co2 ub , lb address a0~a18 d out i/o1~16 r/w ce2 t as t cw t wr valid data in t odw t wp t ds t dh t oew hi-z t cw 1 ce t wc t bw ub , lb (see note 3) (see note 2) (see note 5) (see note 5) address a0~a18 d out i/o1~16 d in i/o1~16
TC55VEM316AXBN40,55 2002-07-23 9/14 write cycle 2 ( controlled) (see note 4) write cycle 3 (ce2 controlled) (see note 4) ce1 r/w t wc t as t wr t wp 1 ce t cw valid data in t ds t dh t be hi-z hi-z ce2 t cw t odw t bw t coe ub , lb (see note 5) r/w t wc t as t wr t wp 1 ce t cw valid data in t ds t dh hi-z hi-z t cw ce2 t bw t be t coe t odw ub , lb (see note 5) address a0~a18 d out i/o1~16 d in i/o1~16 address a0~a18 d out i/o1~16 d in i/o1~16
TC55VEM316AXBN40,55 2002-07-23 10/14 write cycle 4 ( , controlled) (see note 4) note: (1) r/w remains high for the read cycle. (2) if ce1 (or ub or lb ) goes low(or ce2 goes high) coincide nt with or after r/w goes low, the outputs will remain at high impedance. (3) if ce1 (or ub or lb ) goes high(or ce2 goes low) coincide nt with or before r/w goes high, the outputs will remain at high impedance. (4) if oe is high during the write cycle, the outputs will remain at high impedance. (5) because i/o signals may be in the output state at this time, input signals of reverse polarity must not be applied. ub lb r/w t wc t as t wr t wp 1 ce valid data in t ds t dh hi-z hi-z t cw ce2 t bw t be t coe t odw ub , lb t cw (see note 5) address a0~a18 d out i/o1~16 d in i/o1~16
TC55VEM316AXBN40,55 2002-07-23 11/14 data retention characteristics ( ta = ? 40 to 85c ) symbol parameter min typ max unit v dh data retention supply voltage 1.5 ? 3.6 v v dh = 3.6 v ta = ? 40~85c ? ? 10 ta = ? 40~40c ? ? 2 i dds2 standby current v dh = 3.0 v ta = ? 40~85c ? ? 5 a t cdr chip deselect to data retention mode time 0 ? ? ns t r recovery time 5 ? ? ms controlled data retention mode (see note 1) ce2 controlled data retention mode (see note 3) , controlled data retention mode (see note 4) v dd 2.3 v gnd v il data retention mode t r t cdr v dd 0.2 v v ih ce2 ce1 v dd 2.3 v gnd v ih data retention mode t r (see note 2) (see note 2) t cdr v dd v dd ? 0.2 v 1 ce ub lb v dd 2.3 v gnd v ih data retention mode t r (see note 5) (see note 5) t cdr v dd v dd ? 0.2 v ub , lb
TC55VEM316AXBN40,55 2002-07-23 12/14 note: (1) in ce1 controlled data retention mode, minimum standby current mode is entered when ce2 0.2 v or ce2 v dd ? 0.2 v. (2) when ce1 is operating at the v ih (min.) level, the operating current is given by i dds1 during the transition of v dd from 2.3(2.7) to 2.2v(2.4 v). (3) in ce2 controlled data retention mode, minimum standby current mode is entered when ce2 0.2 v. (4) in ub (or lb ) controlled data retention mode, minimum standby current mode is entered when ce1 0.2 v or ce1 v dd ? 0.2 v, ce2 0.2 v or ce2 v dd ? 0.2 v. (5) when ce1 is operating at the v ih (min.) level, the operating current is given by i dds1 during the transition of v dd from 2.3(2.7) to 2.2v(2.4 v).
TC55VEM316AXBN40,55 2002-07-23 13/14 package dimensions unit:mm 0.75 0.75 2.875 2.125 0.375 a (3.75) (5.25) 0.375 sab 0.08 0.4 0.05 2 3 4 5 6 abcdefgh b 1 p-tfbga48-0811-0.75bz 0.1 s s 0.1 s 0.28 0.05 max 1.2 8.0 11.0 s a 0.15 4 sb 0.2 0.2 weight: g (typ)
TC55VEM316AXBN40,55 2002-07-23 14/14 ? toshiba is continually working to improve the quality an d reliability of its products. nevertheless, semiconductor devices in general can malfunction or fail due to their inhe rent electrical sensitivity and vulnerability to physical stress. it is the responsibility of t he buyer, when utilizing toshiba products , to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such toshiba products could cause loss of human life, bodily injury or damage to property. in developing your designs, please ensure that toshiba products are used within s pecified operating ranges as set forth in the most recent toshi ba products specifications. also, pl ease keep in mind the precautions and conditions set forth in the ?handling guide for semicond uctor devices,? or ?toshiba semiconductor reliability handbook? etc.. ? the toshiba products listed in this document are inte nded for usage in general electronics applications (computer, personal equipment, office equipment, measuri ng equipment, industrial robotics, domestic appliances, etc.). these toshiba products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunc tion or failure of which may cause loss of human life or bodily injury (?unintended usage?). unintended usage include atomic energy control in struments, airplane or spaceship instruments, transportation instruments, traffic signa l instruments, combusti on control instruments, medical instruments, all types of safety devices, et c.. unintended usage of toshiba products listed in this document shall be made at th e customer?s own risk. ? the products described in this document are subject to the foreign exchange and foreign trade laws. ? the information contained herein is presented only as a guide for the applications of our products. no responsibility is assumed by toshiba corporation for any infringements of intelle ctual property or other rights of the third parties which may re sult from its use. no license is grant ed by implication or otherwise under any intellectual property or other right s of toshiba corporation or others. ? the information contained herein is subject to change without notice. 000707eba restrictions on product use

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